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Pages: 94-96.
Full text of article: Russian language.
Abstract:
A microrelief with a continuous profile is required for the effective operation of diffractive optical
elements. Such microrelief can be obtained by using photosensitive polymers, such as liquid
photopolymerizable compositions (LPPC), photoresist. For the practical use of diffractive elements
obtained using photosensitive polymers, it is necessary to transfer the relief from the polymer to a
solid substrate [1]. For example, into glass, if the phase element is intended for the operation at high
radiation density, or into silicon, if the element is intended to be reflective, or its matrix is intended
for mass copying of any elements using photoplastics. In the latter case, the relief formed in the solid
substrate is opposite to the required relief. Unlike binary diffractive elements, the elements with a
continuous profile cannot be obtained by liquid etching of a solid substrate (glass, silicon) through
a polymer mask, since the polymer mask in a liquid etchant is much more resistant to destruction
than the substrate. Another technological aspect: if the polymer is still destroyed in the liquid etchant,
then this process cannot be controlled technologically and runs catastrophically in most cases.
In addition, liquid etching is isotropic, which is an additional reason that excludes accurate transfer
of the relief to the substrate. With “dry” etching, the rate of polymer destruction is controllable and
comparable to the rate of etching of a solid substrate. This allows to transfer microrelief into a solid
matrix with a controlled transfer coefficient. This paper is devoted to the study of the technological
feasibility of implementing such a process.
Citation:
Volkov AV, Rybakov OE, Soloviev VS. The study of modes of plasma etching of
synthesized polymerizable compositions. Computer Optics 1997; 17: 94-96.
References:
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