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Preparation of a substrate surface for DOE fabrication using a layered photoresist growth method

A.V. Volkov, N.L. Kazanskiy, O.Y. Moiseev

Image Processing Systems Institute of RAS, Samara

 PDF, 691 kB

Pages: 113-116

Full text of article: Russian language.

Abstract:
The microelectronic technology methods are widely used in DOE microrelief production, these methods allow to produce a stepped relief that approximates the required shape of the DOE surface. In [1, 2], a relatively simple and labor-efficient method was proposed for producing microreliefs by way of layer-by-layer photoresist buildup, which excludes the process of substrate etching. Essentially, a stepped relief of a DOE is formed by multiple layer-by-layer deposition of photoresist layers, which have passed the stages of exposure through the corresponding photomasks and all the treatment processes, including deep hardening.

Citation:
Volkov AV, Kazanskiy NL, Moiseev OY. Preparation of a substrate surface for DOE fabrication using a layered photoresist growth method. Computer Optics 2001. 21: 113-116.

References:
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