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Pages: 127-130
Full text of article: Russian language.
Abstract:
Plasma-chemical or “dry” etching allows to make a profile in any material with the precision and surface quality unattainable for conventional liquid etching. This is achieved due to the features of the anisotropic etching mode, high controllability and stability of technological processes during dry etching.It seems expedient to use plasma-chemical etching to form the microrelief of diffractive optical elements (DOE), as the accuracy of producing the diffractive microrelief determines the quality of the optical elements [1]. In this work, we analyze the applicability of the plasma etching unit UTP PDE-125-009 for the production of diffractive optical elements of the mid-IR range on silicon substrates of the KDB-4.5 brand with a diameter of 76 mm [2]
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Citation:
Volkov AV, Kazanskiy NL, Rybakov OE. Investigation of the technology of plasma-chemical etching for producing multilevel diffractive optical elements. Computer Optics 1998; 18: 127-130.
References:
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